SIB408DK-T1-GE3【PDF 1/9 页】MOSFET N-CH D-S 30V PPAK SC75-6L

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Sheet目录514

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New Product

SiB408DK

Vishay Siliconix

N-Channel 30-V (D-S) MOSFET

PRODUCT SUMMARY

FEATURES

V DS (V)

R DS(on) ( Ω )

0.040 at V GS = 10 V

0.050 at V GS = 4.5 V

I D (A)

7 a

Q g (Typ.)

2.9 nC

? Halogen-free According to IEC 61249-2-21

Definition

? TrenchFET ? Power MOSFET

? New Thermally Enhanced PowerPAK ?

SC-75 Package

- Small Footprint Area

- Low On-Resistance

PowerPAK SC-75-6L-Single

? 100 % R g Tested

? 100 % UIS Tested

? Compliant to RoHS Directive 2002/95/EC

APPLICATIONS

- Load Switch

? Notebook

Markin g Code

AEX

Part # code

XXX

Lot Tracea b ility

1.60 mm

and Date code

Orderin g Information: SiB40 8 DK-T1-GE3 (Lead (P b )-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted

N-Channel MOSFET

Parameter

Drain-Source Voltage

Gate-Source Voltage

T C = 25 °C

Symbol

V DS

V GS

Limit

± 20

7 a

Unit

Continuous Drain Current (T J = 150 °C)

T C = 70 °C

T A = 25 °C

I D

7 a

6 b, c

Pulsed Drain Current

Continuous Source-Drain Diode Current

Avalanche Current Pulse

Avalanche Energy

T A = 70 °C

T C = 25 °C

T A = 25 °C

L = 0.1 mH

I DM

I S

I AS

E AS

4.8 b, c

7 a

2 b, c

T C = 25 °C

Maximum Power Dissipation

T C = 70 °C

T A = 25 °C

P D

8.4

2.4 b, c

T A = 70 °C

1.6 b, c

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) d, e

T J , T stg

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Symbol Typical Maximum Unit

Maximum Junction-to-Ambient b, f t ≤ 5 s R thJA

Maximum Junction-to-Case (Drain) Steady State R thJC

41 51

7.5 9.5

°C/W

Notes:

a. Package limited.

b. Surface Mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under Steady State conditions is 105 °C/W.

Document Number: 64828

S09-0859-Rev. A, 18-May-09

www.vishay.com

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